Flip Chip Bonder - Company Ranking(9 companies in total)
Last Updated： Aggregation Period:Jul 15, 2026〜Aug 11, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Main Features ■ Compatible with microchips (0.25mm and above) (Option: 0.15mm and above) ■ High precision mounting achievable at ±2μm (3... | High-precision die bonder High-precision flip chip bonder COC and COS process implementation for optical device and laser module manufac... | ||
| Main Features ■ Compatible with microchips (0.25mm and above) (Option: 0.15mm and above) ■ High precision mounting achievable at ±2μm (3... | Flip chip mounting, experimentation, evaluation, sample creation High-precision die bonding implementation | ||
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澁谷工業
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- Featured Products
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High-precision die bonder / flip chip bonder FDB210 / 211
- overview
- Main Features ■ Compatible with microchips (0.25mm and above) (Option: 0.15mm and above) ■ High precision mounting achievable at ±2μm (3...
- Application/Performance example
- High-precision die bonder High-precision flip chip bonder COC and COS process implementation for optical device and laser module manufac...
Small-scale production and development die bonder / flip chip bonder DB258
- overview
- Main Features ■ Compatible with microchips (0.25mm and above) (Option: 0.15mm and above) ■ High precision mounting achievable at ±2μm (3...
- Application/Performance example
- Flip chip mounting, experimentation, evaluation, sample creation High-precision die bonding implementation
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澁谷工業
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